Marzia Fiore

Main activities and responsibilities:
-Classification and analysis of defective issues on lots in which DIGS was applied, combined with that on scrapped wafers, with the aim of anticipating verification and correction actions and consequent reduction of the impact on yield.
-Apply previous skills and methodologies of identification, analysis and containment of a problem, with greater focus on NA issues.
-Management of reports for meetings with process areas and external customers.

Main activities and responsibilities:
-Responsible for defects on T9/T9X, M6X, and MEMS and support for analyzing major
defectivity problems on BCD8
-Support to Device R&D Eng for industrialization of OFT60 (in 2014)
• Review of setups and Control Plan (T9/T9X, M6X, OFT60)
• Verification and cross-analysis of defectivity problems with other technologies
• Follow up on issues and action plans
• Work closely with Device Eng on yield improvement activities, involving process engineering, such as:
1.verify the correlation between defect and yield loss, to support the action plan aimed to fix the most critical defects in terms of yield loss and inspection efficiency.
2. identify defects causing failures in EWS and the process step where they are introduced, then, support Dev/Process Eng in review/optimization activities (process change/tuning,etc.)
3. Manage defect lots evaluation, carrying out what has been established: release, scrap, apply DIGS instructions, direct to rework, etc.
4.provide indications for failure analysis
- Manage the control and evaluation of Runs potentially affected by a problem
processes/developments.
-Be part of W.F.Y team, aimed at managing the priority of a problem, classifying it based on the severity, frequency and ease with which it is identifiable,establishing problem solving methods.
-Scratch analysis and management of related reports for meetings with the different areas of the Fab and with external customers

-Support for reduction and resolution of defectivity issues relating to equipments and process integration in litho/etch/epi areas. -Identify improvement steps, anticipate any deviations, identify golden tools and support start-up and redevelopment activities, by analysis of trends/pareto relating to technologies/equipment in the litho, etch, epi areas. -Reference Defectivity Engineer for analysis and reduction of scratches

-Responsible for reducing scratches caused by equipment and human handling on 8" wafers
• Daily analysis of scratches on lots detected by automated defectivity inspection
• Collaborate with engineering/manufacturing/maintenance teams to reduce and resolve scratch issues
• Reports and meetings by area regarding scratches
-Cluster defect analysis, similar to scratches and process/device engineering support for problem elimination -Support for the implementation of the first automatic inspections in Epi area and characterization of defectivity vs problem

Main activities and responsibilities, after reorganization due to the merger of 6" and 8" Production fabs:
- Responsible for optimizing automated inspection of test wafers to monitor handling/particles
in 8" wafer manufacturing equipment.
-Support process engineering with SEM defect characterization and automatic review of test wafers
-Run and menage monitoring tests on KLA-tencor Surface inspection equipment, supporting external
technicians and Maintenance team in troubleshooting hardware/software
-Correlation analysis between failures in the EWS and defects on production wafers, and between defects on production wafers and equipment particle tests, with a focus on scratches
- Creation of a new model for the inspection and automated collection of only "Scratches" in the test
wafers of 8" equipments
-Analysis of problems related to scratches caused by equipment and defects related to human handling on producton's wafers
-Manage scratch control tests on metrology and handling equipment-Creation procedure and implementation of the related control

Main activities and responsibilities:
-Assist the activities of defectivity shift engineers and relations with other department groups, to optimize feedbacks , minimize downtime (Lot on hold and down equipment) and lots impacted by defectivity problem
- Archiving, recovery, analysis and sharing of data, for the timely addressing of new defectivity problems and reoccurences, as well as support for the various process/devices engineer to minimize the impact of the problem and develop decisive actions and containment strategies.
- Management of weekly/monthly reports on issues related to defects and related meetings with process/device/WFY/D0 engineering
-Identification and characterization of Major defectivity problems to identify their origin, by:
• investigation of equipments/process in common in defective lots
• trend Analysis for Technology/ Equipments vs defective step
• correlation analysis between test wafers of the equipment and the defects found on the production
wafers
• step by step investigation
• creation of non-standard setups and identification of inspection equipment suitable for detecting
defects
• SEM and EDX analysis
• indications on the elemental and laboratory analysis of the defect (Fib, Auger, etc.)
• defect die stack analysis vs masking level with device support
waste bin analysis with device support
• brain storming and task force involving Process/ Device Engineer, Maintenance/ Manufacturing
teams
-Central shift work

Main activities and responsibilities: -Management of lots on hold, rework, and wafer scraps, according to specification limits, established procedures and in particular cases to the Devices Group.
-Report defectivity issues to Process/Device Engineering and Defectivity Engineering by Technology - Prepare weekly defect/scrap report for meeting with process/device/W.F.Y. engineering - Support Defect Engineering by Technology in creating and optimizing inspection setups in KLA -Tencor/Applied Materials equipmens -Manual and automatic SEM review and related defect characterization (EDX analysis) -Supervise and coordinate the testing of automatic inspection and review equipment, as well as support external technicians and the maintenance team for the start-up and identification/resolution of hardware/software problems -Continuous interfacing with the Production Group for the management of workload priorities in defectivity equipments and support for the resolution of department problems -Work on 2 shifts

Main activities and responsibilities: -Lots inspection and manual classification of defects. -Run monitoring tests on inspection equipments. -Creation of derivative setups for KLA/ Tencor equipment -Support defect engineering in managing out-of- spec/control issues, lots on hold and down equipments, forming the first defect control team -Shift Work

Main activities and responsibilities:
-Inspection under the optical microscope, verification of the overlay/CD measurements and the thickness of the Resist layer, on the first wafers (8") in production.
-Interaction with department engineering
-Shift Work